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Gap Pad/Thermal Pad

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Application

Thermal interface gap pads (GAP pads) made from silicone materials can be manufactured with varying hardness levels—from high to low—making them suitable for different thickness requirements. Phase change thermal pads are designed to enhance ease of use and achieve low thermal resistance; they remain solid sheets before use and gradually transition to a gel-like state as the temperature rises.

About Products

high plug-in durability T-PAD

Reusable thermal interface material for repeated hot plugging, with scratch and abrasion resistance.

Vertical graphite sheet

Graphite sheets with vertically aligned structure and thermal conductivity, suitable for chips requiring high power output and demanding durability.

Items:

topco_20150210180316_275120.jpg

High hardness thermal insulation pad

topco_20250619004930_828959.jpg

Low hardness thermal conductive pad

topco_20150210180514_443905.jpg

Super soft thermal conductive pad

Items:

topco_20150210180549_733263.jpg

Phase change material

Items:

high plug-in durability T-PAD

Reusable thermal interface material for repeated hot plugging, with scratch and abrasion resistance.

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Vertical graphite sheet

Graphite sheets with vertically aligned structure and thermal conductivity, suitable for chips requiring high power output and demanding durability.

請選擇產品項

High hardness thermal insulation pad

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Low hardness thermal conductive pad

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Super soft thermal conductive pad

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Phase change material

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