2. Excellent gap-filling properties
3.Anti-sagging and high durability
4.Capable of replacing complex manual T-PAD operations
Products
- Silicone Oil
- modified Silicone Oil
- Defoamer
- Release Agent
- Fiber Treatment Agent
- Paint Additives
- Foaming Agent
- Cosmetic raw materials
- konishi:water-based adhesive
- Anti-fouling additive
- Paper Release Agent
- flameretardants
- Silicone PSA
- silicone resin
- SILICATE
- Coupling Agent
- Organic Silicone Powder
- COLCOAT Co., Ltd. Antistatic Agent
- Estone Products
- Jing Feng Products (Acrylic Adhesives)
- ASHIO RESIN for non-silicone release agent
- KANEKA products
- Solid silicone rubber
- Liquid silicone rubber
- Shin-Etsu Polymer conductive polymer ink
- Silicone production machinery
- Matsumoto Microsphere
- Sumitomo PTFE membrane
- View/light path control film (VCF)
- Touch panel related materials
- ECOBOND
- RTV I
- RTV II
- LED
- Grease
- MS-RTV
- Thermal Grease
- Gap Pad/Thermal Pad
- Thermal Gel/Gap Filler
- Sealant
- Adhesive Expert
Thermal Gel/Gap Filler
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Scope of Application
1.Highly Automated Manufacturing
About Products
Thermal Gel
Pre-cured, one-component thermal conductive gel Thermal conductivity range: 1 ~14 W/m·K, available in various types Suitable for automated dispensing
Items：
Gap-Filler
One/two-component adhesives curing after dispensing, fully replacing Thermal-PADs Thermal conductivity range: 1 ~ 14 W/m·K, available in various formulations Compatible with automated dispensing
Items：
Thermal Gel
Pre-cured, one-component thermal conductive gel Thermal conductivity range: 1 ~14 W/m·K, available in various types Suitable for automated dispensing
Gap-Filler
One/two-component adhesives curing after dispensing, fully replacing Thermal-PADs Thermal conductivity range: 1 ~ 14 W/m·K, available in various formulations Compatible with automated dispensing