Its products are widely used in LED packaging, electronic and electrical potting and bonding, thermal management applications, composite materials, and sporting goods. ECOBOND has evolved into a comprehensive materials manufacturer, integrating raw material production, design and development, and sales.
Products
- Silicone Oil
- modified Silicone Oil
- Defoamer
- Release Agent
- Fiber Treatment Agent
- Paint Additives
- Foaming Agent
- Cosmetic raw materials
- konishi:water-based adhesive
- Anti-fouling additive
- Paper Release Agent
- flameretardants
- Silicone PSA
- silicone resin
- SILICATE
- Coupling Agent
- Organic Silicone Powder
- COLCOAT Co., Ltd. Antistatic Agent
- Estone Products
- Jing Feng Products (Acrylic Adhesives)
- ASHIO RESIN for non-silicone release agent
- KANEKA products
- Solid silicone rubber
- Liquid silicone rubber
- Shin-Etsu Polymer conductive polymer ink
- Silicone production machinery
- Matsumoto Microsphere
- Sumitomo PTFE membrane
- View/light path control film (VCF)
- Touch panel related materials
- ECOBOND
- RTV I
- RTV II
- LED
- Grease
- MS-RTV
- Thermal Grease
- Gap Pad/Thermal Pad
- Thermal Gel/Gap Filler
- Sealant
- Adhesive Expert
ECOBOND
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ECOBOND-Epoxy
ECOBOND is a high-tech enterprise specializing in epoxy resin applications, thermal interface materials, and modified thermoplastic polyurethanes. The company is dedicated to providing customers with innovative new material solutions.
About Products
Electromechanical (Motors)
Adhesive solutions for motor assemblies
gap-control adhesive for magnetic components
An epoxy-based thermosetting adhesive containing ultra-high-precision microspheres. It enables simple and accurate control of inductance performance and is suitable for various types of magnetic cores.
IGBT module packaging
Epoxy potting for IGBT modules
Electromechanical (Motors)
Adhesive solutions for motor assemblies
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gap-control adhesive for magnetic components
An epoxy-based thermosetting adhesive containing ultra-high-precision microspheres. It enables simple and accurate control of inductance performance and is suitable for various types of magnetic cores.
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IGBT module packaging
Epoxy potting for IGBT modules
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